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Schroff UK Ltd
Maylands Avenue
Hemel Hempstead
Herts
HP2 7DE
United Kingdom
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01442 24 04 71 |
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01442 21 35 08 |
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schroff-sales@schroff.co.uk
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For more than 40 years Schroff has been a leader in providing reliable protection and solid packaging of electronics. Our success is driven by the realisation of customer´s desires and the understanding of their markets. Being member of the international standard commitees like DIN and IEC, we represent their interests when global standards are developed.
Our product range extends from cabinets, cases and subracks to power supplies, backplanes, climate solutions and a variety of accessories. Our expertise and extensive integration services allow us to combine components inside a cabinet or enclosure – regardless of complexity. Customers benefit from „plug&play“ products for their 19“ technology from a single source, while avoiding interface problems and allowing them to concentrate on their own core competence. Beside complete CPCI and VME/VME64x Systems we also offer customized solutions.
Leading the way in AdvancedTCA, the new standard for high performance computing, Schroff offers several ATCA Systems in different designs as well as accessories such as front panels, filler panels, shelf managers and backplanes.
The newly developed 14-Slot AdvancedTCA-System is particularly suitable for the telecom and network applications including Wireless IP, telephony and optical switching. Through the flexibility and efficiency of the system users obtain an optimally and economically viable unit for their special application. The 14 slot ATCA system fulfils all NEBS requirements (Network Equipment Buyilding Standard) such as temperature management, EMC and it is shock and vibration proof. The new cooling concept guarantees balanced cooling for the installed plug-in units, even if a fan should fail. For a complete system the topology of the connections can be realised in different versions on the integrated backplane.The backplane corresponds to the highspeed requirements of the next board generation to 3,125 Gbps and more.
With the new AdvancedTCA packaging concept Schroff enable the installation of 14 slot ATCA systems in a 42 U high 19" cabinet. Instead of 13 or 14 U systems, here four 10 U high AdvancedTCA systems are integrated into one cabinet. With this the functionality density of the 10 U systems coreresponds to the 13 and 14 U systems which were used previously. The new concept is particulary suited for applications with high board density, when no Rear I/O modules are required. The cooling concept of the 10 U units assembled on top of each other are also new.
For systems integrators, hardware and software developers Schroff have configured a specific 5-Slot- AdvancedTCA-System.The system is equipped with a 5 slot full mesh backplane with two hub slots and through hot swap capable cooling it guarantees a cooling capacity of up to 200 W per slot. Additionally two redundant hot swap capable shelf managers can be integrated. The 4 U high, horizontally installed shelf manager units provide an IPMB interface (Intelligence Platform Management Bus). Based on specific shelf manager mezzanine modules (ShMM) it is preferable to use these shelf managers if the shelf management is not integrated on the board.
Schroff has also developed a new AdvancedTCA backplane with 14 slots for the 19" environment, which supports up to four ports per link with full mesh topology. This is the configuration to the ATCA standard PICMG 3.0 for the highest possible data transfer of up to 2,5 Tbps. Particular attention was paid during the development to the quality of the high speed connections of the so-called fabric interface. As the connections are structured in such a way that they are not tied to a special protocol or bus system and the data throughput is scaleable, the ATCA platforms can be used for the most diverse application, for which the performance of the CompactPCI systems is not sufficient any longer.
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